View BM77SPP03MC2-0004AA_8439051.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 1 bm77spp x3mc2 bluetooth ? 4.0 dual mode module features: ? complete, fully certified, embedded 2.4 ghz bluetooth? version 4.0 module ? bluetooth classic (br/edr) and low energy (le) ? bluetooth sig certified ? onboard embedded bluetooth stack ? transparent u art mode for seamless serial data over uart interface ? easy to configure with window s gui or direct by mcu ? firmware can be field upgradable via uart ? compact surface mount module: 22 x 12 x 2.4 mm ? castellated surface mount pads for easy and reliable host pcb mounting ? environmentally friendly, rohs compliant ? perfect for portable battery operated devices ? internal battery regulator circuitry ? worldwide regulatory certifications operational: ? single operating voltage: 3.2v to 4.3v ? temperature range: -20 to 70c ? sim ple, uart interface ? integrated crystal, internal voltage regulator, and matching circuitry ? mu ltiple i/o pins for control and status rf/analog: ? frequency: 2.402 to 2.480 ghz ? receive sensitivity: - 90 dbm (classic); - 92 dbm (le) ? power output: 2 dbm (typ.) dat a throughput : ? 50 kilobyte (classic on android ) ? 8 kilobyte (le on ios7 ) mac/baseband /higher layer : ? secure aes128 encryption ? gap, sdp, spp, gatt profiles antenna: ? ceramic chip antenna (bm77spps3mc2) ? external antenna connection via rf pad (bm77spp03mc2) compl iance: ? bluetooth sig qdid: b021961 ? modular certified for the united states (fcc) and canada (ic) ? european r&tte directive assessed radio module ? australia, new zealand, korea, taiwan, japan figure 1: general description: the bm77 is a fully - cer tified bluetooth? version 4.0 (br/edr/le) module for designers who want to easily add dual mode bluetooth? wireless capability to their products. delivering local connectivity for the internet of things (iot) , the bm77 bridges your product to smart phones and tablets for convenient data transfer, control and access to cloud applications. this bluetooth sig certified module provides a complete wireless solution with bluetooth stack onboard, integrated antenna, and worldwide radio certifications in a com pact surface mount package, 22 x 12 x 2.4 mm. it supports gap, sdp, spp, and gatt profiles. data is transferred over the bluetooth link by sending/receiving data via transparent uart mode , making it easy to integrate with any processor or microcontroller with a uart interface. configuration is made easy using a windows? based gui or directly via uart by a mcu. applications: ? mobile point of sales (mpos) ? led lighting ? wearables ? digital sports ? fitness devices ? health care/ medical ? automotive accessories ? home automation ? remote control toys 30077 ?WI@^I| 5 ? 5 5f, no.5, industry e. rd. vii, hsinchu science park, hsinchu 30077, taiwan, r.o. c. tel : 886 - 3 - 577 - 8385 fax : 886 - 3 - 577 - 8945 www.issc - tech.com downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 2 1.0 device overview the bm77 is a complete, fully certified, embedded 2.4 ghz bluetooth? version 4.0 (br/edr/le) wireless module. it incorporates an on - board bluetooth stack, cryptographic accelerator, power management subsys tem, 2.4 ghz transceiver, and rf power amplifier (see figure 1 - 1) . with the bm77, designers can embed bluetooth functionality rapidly into virtually any device. the bm77 provides cost and time - to - market savings as a self - contained module solution. the m odule has been designed to provide integrators with a simple bluetooth solution that features: ? ease of integration and programming ? vastly reduced development time ? minimum system cost ? interoperability with bluetooth hosts ? maximum value in a range of applica tions the bm77 can independently maintain a low - power wireless connection. low - power usage and flexible power management maximize the modules lifeti me in battery - operated devices. the bm77 module comes in two varieties. the bm77spps3mc2 is a complete, fully regulatory certified module with integral ceramic chip antenna and shield . the bm77spp03mc2 is a lower cost alternative with external antenna and no shield. the integrator is responsible for the anten na, antenna matching, and regulatory certificat ions. the bm77 is a small, compact, surface mount module with castellated pads fo r easy and reliable host pcb mounting. the module is compatible with standard pick - and - place equipment. table 1 - 1: bm77 module family types device antenna shield regulator y certifications bm77spps3mc2 - 0007aa integral ceramic chip yes fcc, ic, ce, kcc, ncc, japan bm77spp03mc2 - 0007aa external no ce figure 1 -1 : bm77 block diagram ceramic chip antenna (bm77spps3mc2) rf matching configurable control and indication i/o uart 16 mhz external antenna (bm77spp03mc2) i 2 c 8kbit serial eeprom is1677sm power bm77sppx3mc2 1.1 interface description downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 3 the bm77spps3mc2 pin diagram is shown i n figure 1 - 2 and the bm77spp03mc2 is shown in figure 1 - 3. the pin descriptions are shown in table 1 -1 figure 1 - 2: bm77 spps3mc2 pin diagram gnd 1 gnd 2 gnd 3 bat_in 4 sw_btn 5 ldo33_o 6 vdd_io 7 ldo18_o 8 wakeup 9 pmuldo_o 10 p04 11p15 12 p12/scl 13 p13/sda 14 p17/cts 15 p05 16 p00/rts 17 p20 18p24 19 ean 20 reset 21 22 rxd 23 txd 24 p31 25 p32 26 p33 27 p34 28 p36 29 p37 30 led1 31 gnd 32 gnd 33 gnd figure 1 -3 : bm77 spp03mc2 pin diagram gnd 1 bat_in 2 sw_btn 3 ldo33_o 4 vdd_io 5 ldo18_o 6 wakeup 7 pmuldo_o 8 p04 9 p15 10 p12/scl 11 p13/sda 12 p17/cts 13 p05 14 p00/rts 15 p20 16p24 17 ean 18 rst_n 19 20 rxd 21 txd 22 p31 23 p32 24 p33 25 p34 26 p36 27 p37 28 led1 29 gnd 30 bt_rf t able 1 - 1: pin description bm77spps3mc2 bm77spp03mc2 symbol type description downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 4 pin pin 1 -- gnd power ground reference 2 -- gnd power ground reference 3 1 gnd power ground reference 4 2 bat_in power battery input. main positive supply input. connect to 10 uf low esr ceramic capacitor. 5 3 sw_btn di software button h: power on / l: power off (see section 1.6 ) 6 4 ldo33_o power internal 3.3v ldo regulator output . connect to 1 0 uf low esr ceramic capacitor. 7 5 vdd_io power i/o positive supply input . ensure vdd_io and mcu i/o voltages are compatible. 8 6 ldo18_o power internal 1.8v ldo regulator output . connect to 1 0 uf low esr ceramic capacitor. 9 7 wakeup di wakeup from shutdown mode (active low) (internal pull - up) 10 8 pmuldo_o power power ma nag ement unit output. connect to 1 uf low esr ceramic capacitor. 11 9 p04 do status indicator 2 (status_ind_ 2). see section 1.5 12 10 p15 do status indicator 1 (status_ind_1). see section 1.5 13 11 p12/scl do i 2 c scl ( do no t connect) 14 12 p13/sda di o i 2 c sda ( do no t connect) 15 13 p17/cts dio configurable control or indication pin or uart cts (input) 16 14 p05 dio configurable control or indication pin 17 15 p00/rts di o configurable control or indication pin or uart rts (output) 18 16 p20 di syst em configuration (internal pull - up) (see section 1.10 ) 19 17 p24 di system configuration (internal pull - up) (see section 1.10 ) 20 18 ean di system configuration (internal pull - down) (see section 1.10 ) 21 19 rst_n di module reset (active low) (internal p ull - up) apply a pulse of at least 63 ns. 22 20 rxd di uart data input 23 21 txd do uart dat a output 24 22 p31 dio configurable control or indication pin (when configured as input: internal pull - up) 25 23 p32 dio configurable control or indication pin (when configured as input : internal pull - up) 26 24 p33 dio configurable control or indication pin (when configured as input: internal pull - up) 27 25 p34 dio configurable control or indication pin (when configured as input: internal pull - up) 28 26 p36 dio ( do no t connect) 29 27 p37 dio configurable control or indication pin (when configured as input: internal pull - up) 30 28 led1 do s tatus led (see section 1.9 ) 31 29 gnd power ground reference -- 30 bt_rf aio external antenna connection (50 ohm) 32 -- gnd power ground reference 33 -- gnd power ground reference note 1 : pin type abbreviation: a = analog, d = digital, i = input, o = output. 1.2 configuring the bm77 downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 5 configuring the bm77 features can be performed using either mcu commands d ocumented in the issc flash protocol programmers guide , or with the windows ui configuration tool and write eeprom tool. mcu uart commands are documented in bm77spp command set . 1.3 uart interface figures 1 - 4 and 1 - 5 show power and mcu interface examples. the bm77 uart pins txd and rxd connect to the uart pins of the host mcu. it is highly recommended to use hardware flow control pins rts and cts . the bm77 hardware flow control is disabled by default and must be configured to enable. the uart baud is configu rable. the available si gnal rates are listed in table 4 - 5. 1.4 control and indication i/o pins i/o pins p00, p05, p17, p31, p32, p33, p34 and p37 are configurable control and indication i/o . control signals are input to the bm77. indic ation signals are out put from the bm77. table 1 - 2 shows configurable i/o pin assignment to control and indication signals. note that rts can only be assigned to p00 and cts to p17. table 1 - 2: conf iguration and indication i/o assignments n/c uart_rts uart_cts low_b attery_ind link_quality _ind disconnect_control uart_rx_ind discovery_control inquiry control profile_ind p00 default p05 default p17 default p31 default p32 default p33 default p34 d efault p37 default 1.5 status indication i/o pins i/o pins p15 and p04 are status indicator 1 and 2 signals respectively. together they provide status indication to the mcu as shown in table 1 - 3. table 1 - 3: status indication p04/status_ind_2 p15/status_ind_1 indication h h power default / shutdown state h l access state l h link state (no uart data being transmitted) l l link state (uart data being transmitted) 1.6 software button ( sw_btn ) downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 6 the software button ( sw_btn ) input pin powers t he bm77 on (high) or off (low) 1.7 wake up ( wakeup ) the wake up ( wakeup ) input pin wakes the bm77 from shutdown mode (active low). 1.8 reset ( rst_n ) the reset (rst_n) input pin resets the bm77 (active low pulse for at least 63 n s). 1.9 status led ( led1 ) the status led (led1) indicates: ? standby ? inquiry ? link ? link back ? low battery ? page each indication is a configurable flashing sequence. led brightness can also be con figured. 1.10 system configuration i/o pins p20, p24, and ean place the bm77 into operation m odes as shown in table 1 - 4. p20 and p24 each have internal pull - ups. ean has internal pull - down. table 1 - 4: system configuration settings p20 p24 ean operational mode high high low normal operation low high low test (write eeprom) low low high write flash (firmw are programming) 1.11 power figure 1 - 4 shows an example power scheme using a 3.3 volt low - dropout (ldo) regulator supplying 3.3 volts to both the bm77 ( bat_in and vdd_io ) and mcu vdd. this power scheme ensures that bm77 and mcu i/o voltages are compatible. figure 1 - 5 shows an example power scheme using a 3.7 volt lithium - ion battery. the bm77 has an internal 3.3 volt ldo regulator. battery power is applied to bat_in pin. the regulated 3.3 volts output is on the ldo33_o pin. from the ldo33_o pin, voltage can be routed the vdd_io pin and external circuitry including the mcu. this power scheme ensures that b m77 and mcu i/o voltages are compatible. caution: the internal 3.3 volt ldo current source: 50 ma maximum recommended bypass capacitor location and values are shown in figures 1 - 4 and 1 - 5. capacitors can be low esr ceramic. place capacitors close to bm77 module. figure 1 -4 : bm77 to mcu interface example C ldo downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 7 figure 1 -5 : bm77 to mcu interface example C battery bat_in bm77 module (3.2 C 4.3v) ldo33_ovdd_io (note 1) ldo18_o sw_btn txd rxd wakeup p24ean rst_n p20 p12/scl p13/sda p37p34 p33 p32 p31 p04/status_ind_2 p15/status_ind_1 pmuldo_o mcu vdd i/octs rts rx tx nc (2.8 C 3.63v) li-ion battery system configuration p05 p00/rtsp17/cts p36 ncnc i/o i/oi/o i/o i/o i/o i/o i/o i/o i/o (3.7v) note 2 note: 1. ensure vdd_io and mcu vdd voltages are compatible. 2. control and indication ports are configurable. note 1 led1 10uf 10uf nc nc ldo (3.3v) 1.12 mount ing details the bm77 spps3mc2 physical dimensions are shown in figure 1 -6 , recommended host pcb foot print in figure 1 - 7, and mounting suggestion in figure 1 - 8. there should not be top copper layer near the test pin area shown in figure 1 - 7. when laying ou t the host pcb, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in figure 1 -8. a low - impedance ground plane will ensure best radio performance (best range, lowest noise). figure 1 - 8 shows a minimum ground pl ane area to the left and right of the module for best antenna performance . the ground plane can be extended beyond the minimum recommended as need for host pcb emc noise reduction. for best range performance, keep all external metal away from the ceramic chip antenna at least 31 mm. the bm77 spp03mc2 physical dimensions are shown in figure 1- 9, recommended host pcb foot print in figure 1 - 10, and mounting suggestion in figure 1 - 11. it is highly recommended to layout the host pcb as suggested in figure 1 - 11 . a low - impedance ground plane will ensure best radio performance (best range, lowest noise). pin 30 ( bt_rf ) is a 50 ohm connection to an external antenna connector, pcb trace antenna, or component (ceramic chip) antenna through a host pcb 50 ohm micro -s trip trace. this trace can be extended to include passive parts for antenna attenuation p adding, impedance matching, or to provide test posts. it is recommended that the micro - strip trace be as short as possible for minimum loss and best impedance matchi ng. if the micro - strip trace is longer, it should be a 50 ohm impedance. figure 1 - 11 sh ows an example connection to u.fl connector. 1.13 soldering recommendations the bm77 wireless module was assembled using standard lead - free reflow profile ipc/jedec j - std - 020. the module can be soldered to the host pcb using standard leaded and lead - free solder reflow profiles. to avoid damaging the module, the following recommendations are given: downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 8 ? microchip technology application note an233 solder reflow recommendation ( ds00233) provides solder reflow recommendations ? do not exceed peak temperature (t p ) of 250 deg c ? refer to the solder paste data sheet for specific reflow profile recommendatio ns ? use no - clean flux solder paste ? do not wash as moisture can be trapped under th e shield ? use only one flow. if the pcb requires multiple flows, apply the module o n the final flow. downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 9 figure 1 -6 : bm77spps3mcs module dimensions 0.7mm 1.1mm 1.0mm 0.5mm 0.7mm 1.0mm (top view) (bottom view) pad detail (side view) 0.02.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0 0.0 1.8 2.9 4.0 5.1 6.2 7.3 8.4 9.5 10.6 11.7 12.8 13.9 20.1 21.2 2.0 22.0 18.0 0.0 0.6 2.4 0.7 17.3 0.811.2 dimentions are in millimeterstolerances: pcb outline: +/- 0.4 mm pcb thickness: +/- 0.06 mm 0.0 2.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0 0.0 1.8 2.9 4.0 5.1 6.2 7.3 8.4 9.5 10.6 11.7 12.8 13.9 20.1 21.2 22.0 18.0 2.0 10.2 16.95 1 33 19.9 21.5 14.90 18.95 (bottom view) shield mounting hole shield mounting hole 0.8 11.2 figure 1 - 7: bm77spps3mc2 recommeded pcb footprint 1.5mm 0.5mm 0.7mm 1.1mm (top view) 0.0 2.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0 0.0 1.8 2.9 4.0 5.1 6.2 7.3 8.4 9.5 10.6 11.7 12.8 13.9 20.1 21.2 22.0 18.0 2.0 18.0 16.0 keep out area 9.2 11.2 top copper downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 10 figure 1 - 8: bm77spps 3mcs host pcb mounting suggestion downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 11 figure 1 -9 : bm77spp03mcs module dimensions 1.0mm 0.7mm 1.1mm 0.5mm 0.7mm 1.0mm (top view) (bottom view) pad detail (side view) 0.0 2.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0 0.0 1.8 2.9 4.0 5.1 6.2 7.3 8.4 9.5 10.6 11.7 12.8 13.9 15.0 0.0 0.6 dimentions are in millimeters tolerances: pcb outline: +/- 0.4 mm pcb thickness: +/- 0.06 mm 0.0 2.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0 0.0 1.8 2.9 4.0 5.1 6.2 7.3 8.4 9.5 10.6 11.7 12.8 13.9 15.0 1 2.0 2.0 (bottom view) 30 1.8 figure 1 - 10 : bm77spp03mc2 recommeded pcb footprint 0.5mm 1.5mm 0.7mm 1.1mm (top view) 0.0 2.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0 0.0 1.8 2.9 4.0 5.1 6.2 7.3 8.4 9.5 10.6 11.7 12.8 13.9 15.0 2.0 downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 12 figure 1 - 11: bm77spp0 3mcs host pcb mounting suggestion downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 13 2.0 application information 2.2 bm77spps3mc2 ceramic chip antenna the bm77spps3mc2 module contains an integral ceramic chip antenna. the antenna performance on the module is shown in figure 2 - 1. figure 2 - 1: bm77spps3mc2 antenna radiation pattern frequency 2450 mhz max gain 1.63 dbi efficiency 71.55% downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 14 2.3 external configuration and programming the bm77 module can be configured and firmware programm ed using an external configuration and programming tool available from issc technologies. figure 2 - 2 shows the connections between the bm77 and header j1, a standard 8- pin 0.100 (2 . 54 mm) spaced header. it i s recommended to include this header on the host pcb for development. configuration and firmware programming modes are entered according to the sy stem configuration i/o pins (see section 1.8). figure 2 - 2: external programming header connections 1 2 3 4 5 6 7 8 p24gnd txd rxd 5v_usb ean bat_in p20 bat_in bm77 module ldo33_ovdd_io ldo18_o sw_btn txd rxd cts/p17rts/p00 wakeup led1 p24ean rst_n p20 p12/sclp13/sda p37p36 p34 p33 p32 p31 p04p15 pmuldo_o p05 (bm77spp03mc2) bt_rf gnd nc j1 downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 15 3.0 regulatory approval this section outlines the regulatory information for the bm77 ssps3mc2 module for the following countries: ? united states ? canada ? europe ? australia ? new zealand ? japan ? korea ? taiwan ? other regulatory jurisdictions 3.2 united states the bm77ssps3mc2 module has received federal communications commission (fcc) cfr47 telecommunications, part 15 subpart c intentional radiators modular approval in accordance with part 15.212 modular transmitter approval. modular approval al lows the end user to integrate the bm77 module into a finished product without obtaining subsequen t and separate fcc approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. changes or modifications could void the users authority to operate the equipment. the end user must comply with all of the instructions provided by the grantee, which indicate installation and /or operating conditions necessary for compliance. the finished product is required to comply with all applicable fcc equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. for example, compliance must be demonstrated to regulations for other trans mitter components within the host product; to requirements for unintentional radiators (part 15 subpart b unintentional radiators), such as digital devices, computer peripherals, radio receivers, etc.; and to ad ditional authorization requirements for the non - transmitter functions on the transmitter module (i.e., verification, or declaration of conformity) (e.g., transmitter modules may also contain d igital logic functions) as appropriate. 3.2.1 labeling and user information requirements the bm77 module has been labeled with its own fcc id number, and if the fcc id is not visible when the module is installed inside another device, then the ou tside of the finished product into which the module is installed must also display a label referring to the enclosed modu le. this exterior label can us e wording as follows: contains transmitter module fcc id: a8tbm77sppsyc2a or contains fcc id: a8tbm77sppsyc2a this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interfere nce, and (2) this device must accept any interference received, in cluding interference that may cause undesired operation downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 16 a users manual for the finished product should include the following statement: additional information on labeling and user information requirements for part 15 devices can b e found in kdb publication 784748 available at the fcc office of engineering and tec hnology (oet) laboratory division knowledge database (kdb) http://apps.fcc.gov/oetcf/kdb/index.cfm . 3.2.2 rf exposure all transmitters regulated by fcc must comply with rf exposure requireme nts. kdb 447498 general rf exposure guidance provides guidance in determining whether p roposed or existing transmitting facilities, operations or devices comply with limits for human exposure t o radio frequency (rf) fields adopted by the federal communications commission (fcc). from the fcc grant: output power listed is conducted. this grant is valid only when the module is sold to oem integrators and must be installed by the oem or oem in tegrators. this transmitter is restricted for use with the specific antenna(s) tested in this application for certification and must not be co - located or operating in conjunction with any other antenna or transmitters within a h ost device, except in accord ance with fcc multi - transmitter product procedures. 3.2.3 helpful web sites federal communications commission (fcc): http://www.fcc.gov fcc office of engineering and technology (oet) laboratory division k nowledge database (kdb): http://apps.fcc.gov/oetcf/kdb/index.cfm this equipment has been tested and found to comply with the l imits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordanc e with the instructions, may c ause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a part icular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning th e equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ? reorient or relocate the receiving antenna. ? increase the separation between the equipment and receiver. ? connect the equipm ent into an outlet on a circuit different from that to which the receiver is connected. ? consult the dealer or an experienced radio/tv technician for help. downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 17 3.3 canada the bm77ssps3mc2 module has been certified for use in canad a under industry canada (ic) radio standards specification (rss) rss - 210 and rss - gen. modul ar approval permits the installation of a module in a host device without the need to recertify the device. 3.3.1 labeling and user information requirements labeling requirements for the host device (from section 3.2.1, rss - gen, issue 3, december 2010): the hos t device shall be properly labeled to identify the module wi thin the host device. the industry canada certification label of a module shall be clearly visible at all ti mes when installed in the host device, otherwise the host device must be labeled to dis play the industry canada certification number of the module, preceded by the words contains tran smitter module, or the word contains, or similar wording expressing the same meaning, as follows: user manual notice for lice nse - exempt radio apparatus (from section 7.1.3 rss - gen, issue 3, december 2010): user manuals for license - exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: this device complies with industry canada licens e- exempt rss standard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, inclu ding interference that may cause undesired operation of the device. le prse nt appareil est conforme aux cnr d'industrie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deu x conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnemen t. contains transm itter module ic: 12246a - bm77sppsyc2 downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 18 transmitter antenna (from section 7.1.2 rss - gen, issue 3, december 2010): user manuals for transmitters shall display the following notice in a conspicuous location: the above notice ma y be affixed to the device instead of displayed in the user manual. user manuals for transmitters equipped with detachable antennas shall also con tain the following notice in a conspicuous location: immediately following the above notice, the manufacturer shall provide a list o f all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dbi) and required impedance for each. 3.3.2 rf exposure all transmitters regulated by ic must co mply with rf exposure requirements listed in rss - 102 - radio frequency (rf) exposure compliance of radiocommunicatio n apparatus (all frequency bands). (get direct quote from certificate and place here) this radio transmitter (identify the device by certification number, or mod el number if category ii) has been approved by industry canada to operate with the antenna types listed below with the maximum permissi ble gain and required antenna impedance for each antenna type indicate d. antenna types not included in this list, having a gain greater than the ma ximum gain indicated for that type, are strictly prohibited for use with this device. conformment la rglementation d'industrie canada, le prsent metteu r radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. under industry canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain app roved for the transmitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successfu l communication. conformment la rglementation d'industrie canada, le prsent metteu r radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne d passe pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 19 3.3.3 helpful web sites industry canada: http://www.ic.gc.ca/ 3.4 europe the bm77spps3mc2 module is an r&tte directive assessed radio module that is ce marked and has been manufactured and tested with the intention of being in tegrated into a final product. the bm77 module has b een tested to r&tte directive 1999/5/ec essential requirements for health a nd safety (article (3.1(a)), electromagnetic compatibility (emc) (article 3. 1(b)), and radio (article 3.2) and are summarized in table 3 - 1: european compliance testing . a notified body opinion has also been issued. all test reports are available on the bm77 product web page at http://www.microchip.com /bm77 . the r&tte compliance association provides guidance on mod ular devices in document techn ical guidance note 01 available at http://www.rtteca.com/html/download_area.htm . 3.4.1 labeling and user information requirements the label on the final product which con tains the bm77 module must follow ce marking requirements. the r&tte compliance association technical guidance note 01 provides guidance on final product ce marking. 3.4.2 antenna requirements from r&tte compliance association document technical guidance note 0 1 : provided the integrator installing an assessed radio module with an integral o r specific antenna and installed in conformance with the radio module manufacturers installation in structions requires no further evaluation under article 3.2 of the r&tte di rective and does not require further involvement of an r&tte directive notified body for the final prod uct. [section 2.2.4] the european compliance testing listed in table 3 -1 was p erformed using the integral ceramic chip antenna. table 3 - 1: european compliance testing certification standards article laboratory report number date safety en 60950 -1:2006+a11:2009+a1:2010 (3.1(a)) health en 50371:2002 -03 emc en 301 489 - 1 v1.8.1 (2008 -04) (3.1(b)) en 301 489 - 17 v2.1.1 (2009 -05) radio en 300 328 v1.7.1 (2006 -10) (3.2) notified body opinion note: to maintain conformance to the testing listed in table 3 - 1: european compliance testing , the module shall be installed in accordance with the installation instr uctions in this data sheet and shall not be modified. when integrating a radio module into a completed product the integrator bec omes the manufacturer of the final product and is therefore responsible for demonstrating compliance o f the final product with the essential requirements of the r&tte directive. pending downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 20 3.4.3 helpful web sites a document that can be used as a starting point in understand ing the use of short range devices (srd) in europe is the european radio communications committee (erc) reco mmen dation 70 - 03 e, which can be downloaded from the european radio communications offic e (ero) at: http://www.ero.dk/ . additional helpful web sites are: ? radio and telecommunications terminal equipment (r&tte): http://ec.europa.eu/enterprise/rtte/index_en.htm ? european conference of postal and telecommunications administrations (cept): http://www.cept.org ? european telecommunicatio ns standards institute (etsi): http://www.etsi.org ? european radio communications office (ero): http://www.ero.dk ? the radio and telecommunications terminal equipment compliance associati on (r&tte ca): http://www.rtteca.com/ 3.5 australia the australia radio regulations do not provide a modular approval policy similar to the united states (fcc) and canada (ic). however, bm77 module rf transmitter test report s can be used in part to demonstrate compliance in accordance with acma radio communications s hort range devices standard 2004 (the short range devices standard calls up the a s/nzs 4268:2008 industry standard). the bm77 module test reports can be used as part of the product certification and compliance folder. for more information on the rf transmitter test reports, contact mic rochip technology australia sales office. to meet overall australian final product compliance, the developer must cons truct a compliance folder containing all relevant compliance test reports e.g. rf, emc, electrical safety an d doc (declaration of conformity) etc. it is the responsibility of the integrator to know wh at is required in the compliance folder for acma compliance. all test reports are available on the bm77 product web page at http://www.microchip.com . for more information on australia compliance, refer to the australian communications and media authority web site http://www.acma.gov.au/ . 3.5.1 helpful web sites the australian communications and media authority: www.acma.gov.au/ . 3.6 new zealand the new zealand radio regulations do not provide a modular approval policy similar to the united states (fcc) and canada (ic). however, bm77 module rf transmitter test reports can be used in part to demonstrate compliance against the new zealand general user radio license fo r short range devices. new zealand radio communic ations (radio standards) notice 2010 calls up the as / nz s 4268:2008 industry standard. the bm77 module test reports can be used as part of the product pending pending downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 21 certification and compliance folder. all test reports are available on the bm77 product web page at http://www.microchip.com /bm77 . for more information on the rf transmitter test reports, contact microchip technology sales office. information on the new zealand short range devices license can be found in the following web links: http://www.rsm.govt.nz/cms/licensees/types - oflicence/general - user - licences/short - range - devices and http://www.rsm.govt.nz/cms/policy - and - planning/spectrum - policy - overview/legislation/gazette - notices/product - compliance/ . to meet overall new zealand final p roduct compliance, the developer must construct a compli ance folder containing all relevant compliance test reports e.g. rf, emc, electri cal safety and doc (declaration of conformity) etc. it is the responsibility of the develo per to know what is required in the compliance folder for new zealand radio communications. for more information on new zealand compliance, refer to the web site http://www.rsm.govt.nz/ . 3.6.1 helpful web sites radio spectrum ministry of economic deve lopment: http://www.rsm.govt.nz/ . 3.7 japan the bm77ssps3mc2 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the tec hnical standards regulated by the ministry of internal affairs and communications (mic) of japan pursu ant to the radio act of japan. integration of this module into a final product does not require additional radi o certification provided installation instructions are followed and no modifications of the module are all owed. additional testing may be required: ? if the host product is subject to electrical appliance safety (for exam ple, powered from an ac mains), the host product may require product safety electrical appliance an d material (pse) testing. the integrator should contact their conformance laboratory to determine if this testing is required. ? there is an voluntary electromagnetic compatibility (emc) test for the hos t product administered by vcci: http://www.vcci.jp/vcci_e/index.html 3.7.1 labeling and user information requirements the label on the final product which contains the bm77 module must follow japan marking requirements. the integrator of the module should refer to the labeling requirements for japan available at the ministry of internal affairs and communications (mic) website. the bm77 module is labeled with its own technical conformity mark and certification numb er. the final product in which this module is being used must have a label referring to the type certified module inside: downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 22 3.7.2 helpful web sites ministry of internal affairs and communications (mic): http://www.tele.soumu.go.jp/e/index.htm association of radio industries and businesses (arib): http://www.arib.or.jp/english/ 3.8 korea the bm77ssps3mc2 module has received certification of conformity in accordance with th e radio waves act. integration of this module into a final product does not require add itional radio certification provided installation instructions are followed and no modifications of the m odule are allowed. 3.8.1 labeling and user information requirements t he label on the final product which contains the bm77 module must follow kc marking requirements. the integrator of the module should refer to the labeling requirements for kor ea available on the korea communications commission (kcc) website. the bm77 mo dule is labeled with its own kc mark. the final product requires the kc mark and certificate number of the module: 3.8.2 helpful web sites korea communications commission (kcc): http://www.kcc.go .kr national radio research agency (rra): http://rra.go.kr 3.9 taiwan the bm77ssps3mc2 module has received compliance approval in accordance with the telecommunications act. customers seeking to use the compliance appro val in their product should contact microchip technology sales or distribution partners to obtain a l etter of authority. integration of this module into a final product does not require additional radi o certification provided installation instructions are follow ed and no modifications of the module are allowed. 3.9.1 labeling and user information requirements the bm77 module is labeled with its own ncc mark and certificate number as below: (number) contains transmitter module with certificate number: 202 - smc066 pending downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 23 the users manual should contain below warning (for rf device) in tradition al chinese: ? ! ????Ck ?l ?JC???l?C?S? ?????l?????O? ??? ??l ?l?C???w??_??? lF?_Fr??Ko?_r^m? ???????I?o? ?l?C??????I?Wt?? ?CO??_ 3.9.2 helpful web sites national communications commission (ncc): http://www.ncc.gov.tw 3.10 other regulatory jurisdictions should other regulatory jurisdiction certification be required by the custom er, or the customer need to recertify the module for other reasons, a c ertification utility is available. for further regulatory certification utility and documentation, contact issc technologies corp . downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 24 4.0 electrical characteristics table 4 - 1: environmental conditions parameter value temperature range (operating) - 20 to 70 c temperature range (storage) - 40 to 85 c relative humidity (operating) 10% to 90% relative humidity (storage) 10% to 90% moisture sensitivity level 2 table 4 - 2: electrical characteristics parameter min. typ. max. units supply voltage (bat_in) 3.2 4.3 v i/o supply voltage (vdd_io) 2.8 3.3 3.63 v i/o voltage levels v il input logic levels low - 0.3 0.8 v v ih input logic levels high 2.0 3.6 v v ol output logic levels low 0.4 v v oh output logic levels high 2.4 v reset v th,res threshold volt age 1.6 v input and tri - state current with pull - up resistor 65 kohm leakage current - 10 10 ua supply current tx mode 70 ma rx mode 70 ma table 4 - 3: supply consumption C classic ( 1) parameter current (avg .) units notes standby mode 2.543 ma deep power down mode 0.343 ma connected + sniff, master (no data) 0.858 ma no data was transmitted sniff interval = 500ms connected + sniff, slave (no data) 0.864 ma no data was transmitted sniff interval = 500ms data, master 23.03 ma (data transm itted at 115200 bps; block size=500) data, slave 25.597 ma (data transmitted at 115200 bps; block size=500) note 1 : classic br/edr, rx_ind function enabled downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 25 table 4 - 4: supply consumption C low energy (1) parameter current (avg.) units notes standb y mode (discoverable & connectable mode) 1.237 ma le fast advertising interval = 160 ms, s tandby at 0 ~ 30 sec standby mode (discoverable & connectable mode) 0.765 ma le reduced power advertising interval = 961 ms, standby after 30 sec deep power down m ode 0.348 ma connected (no data) connection interval = 500ms 0.679 ma no data was transmitted connection interval = 500 ms, latency=2. connected (transfer data) connection interval = 500ms 13.073 ma c onnection interval = 500 ms, latency=2. connected (n o data) connection interval = 20ms 1.648 ma no data was transmitted connection interval = 20 ms, latency=2. connected (transfer data) connection interval = 20ms 18.581 ma c onnection interval = 20 ms, latency=2. note 1 : low energy , rx_ind function enabl ed table 4 - 5: uart baud baud crystal frequency (mhz) actual baud error rate (%) 921600 16 941176 2.12 460800 16 457143 - 0.79 307200 16 307692 0.16 230400 16 231884 0.64 115200 16 117647 2 .1 57600 16 5 7145 - 0.97 38400 16 38462 0.16 28800 16 28623 - 0.62 19200 16 19231 0.16 14400 16 14480 0.55 9600 16 9615 0.16 4800 16 4808 0.16 2400 16 2399 - 0.03 downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 26 4.0 ordering information table 4 - 1: ordering information part number description bm77spps3mc2 - 0007aa bluetooth? 4.0 dual mode, class 2, surface mo unt module with integral antenna, with shield bm77spp03mc2 - 0007aa bluetooth? 4.0 dual mode, class 2, surface mount module, external antenna, no shield ev77spps3mc2a evaluation board for the bm77spps3mc2 bluetooth dual mode module with usb cable downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 27 appe ndix a: revision history revision 2.0 (october 2014) added content and editing. revision 2.1 .1 ( june 2 01 5) updated operating temperature range and taiwan ncc certification information. downloaded from: http:///
bm77 sppx3mc2 ? 201 4 issc technologies corp. preliminary revision 2. 1.1 C june 16 , 2015 page 28 notes : downloaded from: http:///

▲Up To Search▲

Price & Availability of BM77SPP03MC2-0004AA

	To Download BM77SPP03MC2-0004AA Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .